LM-MG24 Module Specification

Overview

The Aqara MG24 module solution is an ideal mesh IoT wireless connectivity option, built on the EFR32MG24 chip featuring a Cortex®-M33 core with a maximum operating frequency of 78.0 MHz, up to 1536 KB of Flash memory, and 256 KB of RAM. It supports development of wireless communication technologies such as Matter, OpenThread, and Zigbee, and includes reserved IPx antenna interface and PCB antenna interface.

List of Hardware Resources

Module size: 18(±0.35) × 18(±0.35) × 5(±0.35) mm, SMD (36-pin) type
Wide operating voltage range: 2.0 V to 3.8 VDC
Optional antenna: IPX antenna or PCB antenna

System on chip:

• High-performance 32-bit 78.0 MHz ARM Cortex®-M33 is adopted, which processes signals using DSP instructions and floating-point operations
• 1536 kB flash, 256 kB RAM

Radio-frequency signal

• 2.4 GHz radio operation
• -105.4 dBm sensitivity @ 250kbps O-QPSK DSSS
• -105.7 dBm sensitivity @ 125kbps GFSK
• -97.6 dBm sensitivity @ 1 Mbps GFSK
• -94.8 dBm sensitivity @ 2 Mbps GFSK

Power dissipation

• 4.4 mA RX current (1 Mbps GFSK)
• 5.1 mA RX current (250 kbps O-QPSK DSSS)
• 5 mA TX current @ 0 dBm output power
• 19.1 mA TX current @ 10 dBm output power
• 156.8 mA TX current @ 19.5 dBm output power
• 33.4 μA/MHz in Active Mode (EM0) at 39.0 MHz
• 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)

Introduction to the Hardware System

Module Pin Layout and Application

General-purpose I/O port

Pin Name	Description	Special Instructions for Use as an Enabling Module
PB05	GPIO	Reset user MCU, active low.
PB03	GPIO	It is used as the wake-up port in low-power devices. The user's MCU wakes up the enabling module and connects an external 100K pull-up resistor; if the device is not a low-power device, it can be left unconnected.
PB01	GPIO	As an ISP function, it connects to the I/O ports of the user's MCU and is used for OTA updates of the user's MCU.
PB00	GPIO	Used as the wake-up port in low-power devices. The empowerment module activates the user's MCU. It needs to be connected to the external interrupt port of the user's MCU, and an external 100K pull-up resistor should be connected. If the device is not a low-power device, it can be left unconnected.
PA05	Module UART TX	The communication interface connecting to the user's MCU.
PA06	Module UART RX
VCC_3V	Connect to Power	Module power supply 3.3V VCC.
PC00	FLASH_DI	Used for modding and hacking - 4M FLASH.
PC03	FLASH_WP
PC01	FLASH_CLK
PC02	FLASH_HOLD
PC04	FLASH_DO
PC05	FLASH_CS
PCB_ANT	2.4 GHz RF input/output	A π network needs to be connected between the PCB antenna and the antenna port.(CLC).
GND	Connect to Ground	Module grounding GND.
The other unused pins are left floating.

Function Debugging of I/O ports

Order Number	Pin Name	Functional Description
1	VCC	Positive terminal of the power supply
2	GND	Negative terminal of the power supply
3	RSTN	Reset pin, the RESETn pin is internally pulled up to DVDD
4	PA09	GPIO
5	PA08	GPIO
6	PA03	GPIO
7	PA02	GPIO
8	PA01	GPIO
9	PD05	GPIO
10	PD04	GPIO

Packaging Requirements

Package name: CONNECT - PH - 2X5 - 1.27mm

The numbering of the solder pads is uniformly arranged as follows:

tip

The RSTN reset is internally pulled up, so an external pull-up resistor is no longer required. Connecting a pull-up resistor externally may create a leakage current path, increasing the module's standby current.

Absolute Maximum Ratings

Parameter	Symbol	min	max	Unit
Voltage on any supply pin	VDDMAX	-0.3	3.8	V
Voltage ramp rate on any supply pin	VDDRAMPMAX	-	1.0	V/us
DC voltage on any GPIO pin	VDIGPIN	-0.3	VDD+0.3	V

Reference Design Circuit

Module Size and Recommended Packaging

Schematic Diagram Packaging

PCB Package

Package name: BLE-MG24MODULE.

Single pad size: 1.6mm * 0.8mm, pad spacing 1.3mm

Attention

Flash Needs to be Reserved for Packaging on the Substrate

Aqara project generally has the requirement for external Flash expansion, and the corresponding required I/O ports are as shown in the table below.

Pin Name	Pin Attribute	Flash Interface Function
PC00	GPIO	FLASH_DI
PC03	GPIO	FLASH_WP
PC01	GPIO	FLASH_CLK
PC02	GPIO	FLASH_HOLD
PC04	GPIO	FLASH_DO
PC05	GPIO	FLASH_CS

The WP and HOLD signals of Flash can be pulled on the substrate. For the specific packaging and model of Flash that need to be reserved, please confirm with the hardware engineer of the Aqara.

Reference design:

The table below lists the recommended flash models.

Type	Vendor	Memory Capacity	Specification
ZB25VQ32ETJG	ZbitSemi	4M byte	Nor Flash\32M-bit\2.3V-3.6V\SOP8-150mil\
ZB25VQ32DDJG	ZbitSemi	4M byte	Nor Flash\32M-bit\2.3V~3.6V\DFN8 2*3mm\
ZB25VQ32DTJGR	ZbitSemi	4M byte	Nor Flash\32M-bit\2.3V-3.6V\SOP8-150mil\
PY25Q32HB-SSH-KR-SF	Puya	4M byte	Nor Flash\32M-bit\2.3V3.6V-40105℃\SOP8\
XT25F32FSOIGT	XTX	4M byte	Nor Flash\32M-bit\2.7V-3.6V\SOP8-150mil\

Two Antenna Design Methods

The first type features IPEX generation sockets on the module, which can be snapped together.

The second method involves using the top pins of the module to transmit the antenna signal to the bottom plate, and then designing the antenna form on the bottom plate.

By adjusting the welding states of resistors R3 and R4, the antenna connection mode of the MG24 module can be selected: IPX antenna or external PCB antenna.

Antenna Solution	R3	R4
IPX ANT	×	√
PCB ANT	√	×

tip

×: No wielding.
√: Wielding.

Schematic Diagram:

Configuration Options

To better meet the requirements of different projects, this module offers the following hardware configurations for selection.

	Configuration Options	Applicable For
Antenna method	PCB Antenna: Built-in printed antenna, no additional assembly required, low cost, suitable for compact overall design of the device. IPX Antenna: Connects to an external FPC antenna or rod antenna via an IPX connector. The antenna position can be flexibly arranged, facilitating the optimization of RF performance.	PCB antenna: Suitable for products with limited space, simple antenna environment, and high requirements for production consistency (such as smart sockets, small household appliances). IPX antenna: Suitable for scenarios where the outer casing is made of metal or is covered by a large screen, where long-distance transmission is required or where the on-site signal is complex (such as gateways, industrial sensors).
radio-frequency power	10dBm: Lower power consumption, lower power supply requirements, suitable for short-range communication. 20dBm: Longer coverage distance, stronger ability to penetrate walls, but with higher transient current (requires DVDD 3.3V power supply).	10dBm: Suitable for devices with short transmission distances, those sensitive to the overall power consumption, or those powered by button batteries. 20dBm: Suitable for applications requiring long-range coverage or complex indoor environments (such as multi-story buildings, warehouses).
Power consumption configuration	With low-power inductor Without low-power inductor	Low-power inductors are used in DC-DC power circuits, which can effectively reduce the static current of the module during deep sleep and receiving states, significantly enhancing the battery-powered device's endurance.
Crystal oscillator configuration1	85℃ Crystal 105℃ Crystal	85°C Crystal Oscillator: Suitable for regular indoor and office environments. 105°C Crystal Oscillator: Applicable to equipment exposed to direct sunlight, around heating appliances, and inside car cabins, ensuring long-term reliability in high-temperature scenarios.
Crystal oscillator configuration2	With 32.768k crystal oscillator Without 32.768k crystal oscillator	Provide a precise and stable clock source. It is commonly used in scenarios such as precise timing, calendar, and timed wake-up. Optimize the BOM.