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LM-MG24-S Module Specification

Overview

The Aqara MG24 module solution is an ideal mesh IoT wireless connectivity option, built on the EFR32MG24 chip featuring a Cortex®-M33 core with a maximum operating frequency of 78.0 MHz, up to 1536 KB of Flash memory, and 256 KB of RAM. It supports development of wireless communication technologies such as Matter, OpenThread, and Zigbee, and includes reserved IPx antenna interface and PCB antenna interface.

List of Hardware Resources

Module size: 18(±0.35) × 18(±0.35) × 5(±0.35) mm, surface-mounted 24-pin;
Wide operating voltage range: 2.0 V to 3.8 VDC

Radio-frequency signal

  • 2.4 GHz radio operation
  • -97.6 dBm sensitivity @ 1 Mbps GFSK
  • -94.8 dBm sensitivity @ 2 Mbps GFSK

Power consumption

  • 4.4 mA RX current (1 Mbps GFSK)
  • 5 mA TX current @ 0 dBm output power
  • 19.1 mA TX current @ 10 dBm output power
  • 156.8 mA TX current @ 19.5 dBm output power
  • 33.4 μA/MHz in Active Mode (EM0) at 39.0 MHz
  • 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)

Introduction to the Hardware System

Hardware Schematic Diagram

Module Pin Layout and Application

Module pin layout and application

General-purpose I/O port

Pin NameDescriptionSpecial Instructions for Use as an Enabling Module
PB05GPIOReset user MCU, active low.
PB01GPIOAs an ISP function, it connects to the I/O ports of the user's MCU and is used for OTA updates of the user's MCU.
PA05Module UART TXThe communication interface connecting the user MCU.
PA06Module UART RX
PB00GPIOUsed as the wake-up port in low-power devices, this module enables the user MCU to be awakened. It needs to be connected to the external interrupt port of the user MCU, and an external 100K pull-up resistor should be connected. If the device is not a low-power device, it can be left unconnected.
PB03GPIOUsed as the wake-up port in low-power devices, this module enables the user's MCU to be awakened. It needs to be connected to the external interrupt port of the user's MCU, and an external 100K pull-up resistor should be connected. If the device is not a low-power device, simply leave it unconnected.
PC01FlASH_CLKUsed for modding and hacking - 4M FLASH.
PC05FlASH_CS
PC00FlASH_DI
PC04FlASH_DO
ANT2.4 GHz RF input/outputBuilt-in antenna mode antenna outlet.
VCC_3V3Connect to PowerModule power supply 3.3V VCC.
GNDConnect to GroundModule grounding GND.
The other unused pins are left floating.

Function Debugging of I/O ports

Order NumberPin NameFunctional Description
1VCCPositive terminal of the power supply
2GNDNegative terminal of the power supply
3RSTNReset pin, the RESETn pin is internally pulled up to DVDD
4PA09GPIO
5PA08GPIO
6PA03GPIO
7PA02GPIO
8PA01GPIO
9NCThe module does not have this pin; keep it floating
10NCThe module does not have this pin; keep it floating

Packaging Requirements

Package name: CONNECT - PH - 2X5 - 1.27mm

The numbering of the solder pads is uniformly arranged as follows:

Pic 1
Pic 2

tip

The RSTN reset is internally pulled up, so an external pull-up resistor is no longer required. Connecting a pull-up resistor externally may create a leakage current path, increasing the module's standby current.

Absolute Maximum Ratings

ParameterSymbolMinMaxUnit
Voltage on any supply pinVDDMAX-0.33.8V
Voltage ramp rate on any supply pinVDDRAMPMAX-1.0V/us
DC voltage on any GPIO pinVDIGPIN-0.3VDD+0.3V

Reference Design Circuit

Circuit

Schematic Diagram Packaging

Schematic diagram packaging

PCB Packaging

Package name:BLE-Small-MG24Module.

PCB1

PCB2

Single pad size:1.6mm*0.8mm,Pad spacing 1.3mm

Attention

Flash Needs to be Reserved for Packaging on the Substrate.

Aqara project generally has the requirement for external Flash expansion, and the corresponding required I/O ports are as shown in the table below.

Pin NamePin AttributeFlash Interface Function
PC01GPIOFLASH_CLK
PC05GPIOFLASH_CS
PC00GPIOFLASH_DI
PC04GPIOFLASH_DO

The WP and HOLD signals of Flash can be pulled on the substrate. For the specific packaging and model of Flash that need to be reserved, please confirm with the hardware engineer of the Aqara.

Reference design:

Flash reference

The table below lists the recommended flash models.

TypeVendorMemory CapacitySpecification
ZB25VQ32ETJGZbitSemi4M byteNor Flash\32M-bit\2.3V-3.6V\SOP8-150mil\
ZB25VQ32DDJGZbitSemi4M byteNor Flash\32M-bit\2.3V~3.6V\DFN8 2*3mm\
ZB25VQ32DTJGRZbitSemi4M byteNor Flash\32M-bit\2.3V-3.6V\SOP8-150mil\
PY25Q32HB-SSH-KR-SFPuya4M byteNor Flash\32M-bit\2.3V3.6V-40105℃\SOP8\
XT25F32FSOIGTXTX4M byteNor Flash\32M-bit\2.7V-3.6V\SOP8-150mil\

Two Antenna Design Methods

The first type features IPEX generation sockets on the module, which can be snapped together.

The second method involves using the top pins of the module to transmit the antenna signal to the bottom plate, and then designing the antenna form on the bottom plate.

By adjusting the welding states of resistors R3 and R4, the antenna connection mode of the MG24 module can be selected: IPX antenna or external PCB antenna.

Antenna SolutionR3R4
IPX ANT×
PCB ANT×
tip

×: No wielding.
√: Wielding.

Schematic Diagram:

Schematic Diagram

Configuration Options

To better meet the requirements of different projects, this module offers the following hardware configurations for selection.

Configuration OptionsApplicable For
Antenna method
  • PCB Antenna: Built-in printed antenna, no additional assembly required, low cost, suitable for compact overall design of the device.
  • IPX Antenna: Connects to an external FPC antenna or rod antenna via an IPX connector. The antenna position can be flexibly arranged, facilitating the optimization of RF performance.
  • PCB antenna: Suitable for products with limited space, simple antenna environment, and high requirements for production consistency (such as smart sockets, small household appliances).
  • IPX antenna: Suitable for scenarios where the outer casing is made of metal or is covered by a large screen, where long-distance transmission is required or where the on-site signal is complex (such as gateways, industrial sensors).
Radio-frequency power
  • 10dBm: Lower power consumption, lower power supply requirements, suitable for short-range communication.
  • 20dBm: Longer coverage distance, stronger ability to penetrate walls, but with higher transient current (requires DVDD 3.3V power supply).
  • 10dBm: Suitable for devices with short transmission distances, those sensitive to the overall power consumption, or those powered by button batteries.
  • 20dBm: Suitable for applications requiring long-range coverage or complex indoor environments (such as multi-story buildings, warehouses).
Power consumption configuration
  • With low-power inductor
  • Without low-power inductor
Low-power inductors are used in DC-DC power circuits, which can effectively reduce the static current of the module during deep sleep and receiving states, significantly enhancing the battery-powered device's endurance.
Crystal oscillator configuration
  • 85℃ Crystal
  • 105℃ Crystal
  • 85°C Crystal Oscillator: Suitable for regular indoor and office environments.
  • 105°C Crystal Oscillator: Applicable to equipment exposed to direct sunlight, around heating appliances, and inside car cabins, ensuring long-term reliability in high-temperature scenarios.